Multi-die assemblies are the next phase of Moore’s Law, scaling up and out to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the ...

Tightly coordinated data movement and low-latency on-chip storage for real-time environments.

Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...

Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.

A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...

Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...

A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...

A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...

Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...

Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...

Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale” was published by researchers at Cornell ...