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Ask the builder: What makes a chimney dangerous

Each week, I receive quite a few emails from readers of this column. I treasure each one because they provide a window to ...
IEEE

Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and ...

Abstract: Low resistance Cu interconnects with CVD Ru liner have been demonstrated for 7 nm node. Ru liner thickness reduction has been achieved by replacing PVD TaN with a bilayer PVD Ta and ALD TaN ...